Announced in February North American semiconductor equipment bookings and billings (Book-to-BillRatio) to only 0.48, but with the urgent and short single-speed single-back, the semiconductor equipment market has seen Chunyan. Analysts estimate foreign capital, Intel, TSMC, Nanya, Toshiba, Samsung and many other manufacturers, has begun purchasing wafer equipment, UMC also began plans to purchase 45 and 40 nm devices.
The world's largest semiconductor equipment according to Applied Materials, the estimated plant, equipment market last year by the financial tsunami, the scale of expenditure has been reduced to 23.9 billion U.S. dollars, the annual reduction rate of about 31%, 50% this year may be further reduced to 100 billion to scale of 12 billion U.S. dollars, setting a minimum investment amount in 15 years. SEMI has announced in February the North American semiconductor equipment B / B value of 0.48, the order amount is SEMI statistics compiled since 1991, B / B value is low since.
On the occasion of pessimism in the market one, with the wafer foundries and IDM plant capacity utilization in the acute and short-single-single-driven rebound after another, top semiconductor manufacturers and equipment manufacturers have begun to discuss the procurement of equipment plan Let is experiencing the worst recession in the history of semiconductor equipment market economy, show the bottom of the sign inversion recovery.
EdwinMok analyst estimates in its latest research report, Intel, TSMC, Nanya, Toshiba, Samsung and other manufacturers have the opportunity to see the purchase of equipment. Wafer foundry Taiwan Semiconductor Manufacturing Company, for example, plans to 10,000 per month for 65 nm production, conversion of 45 and 40 nm in the hope that less than 1% of total revenue of 45 and 40 nm revenues, In the fourth quarter to improve to 10% weighting. The TSMC is expected to be required for 45 nm devices began shipping in late May, the procurement value of about 3 to 400,000,000 U.S. dollars. As the impact of this wave of depression
IDM works, many of IDM plant will reduce capital spending and to accelerate the outsourcing contract, and therefore estimates foundry capital spending in 2010, returned to temperature, in addition to TSMC in the second quarter on will begin the procurement of equipment, the report noted that UMC will begin preparations for and investment in the 45 and 40 nm production, and begin to use capital expenditure actions.
Part in the memory market, DRAM factory still faces losses despite the pressure, but the Taiwan government has made it clear that it will not provide direct financial assistance to the DRAM factory, so Nanya order to remain competitive, must invest in upgrading technology this year, the Church Dream up the trench process (trench) Micron Technology Transfer into the stack-type process (stack). Mok expected the park will be about 580 million U.S. dollars through a (NT 20 billion yuan) of the budget, but spending this year, of which only a part.
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